一、課程說明(Course Description)
<br>This course lectures on fundamentals of semiconductor processing technology. Students could learn from this course the history of semiconductor industry, types of equipment, operation principle for each processing step, as well as some basic but important concepts regarding the manufacturing of semiconductor devices and ICs. Outline of the course is: 
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<br>Ch.1 Introduction 
<br>Ch.2 Introduction of IC Fabrication
<br>Ch.3 Semiconductor Basics
<br>Ch.4 Wafer Manufacturing and Epitaxy 
<br>Ch.5 Thermal Processes
<br>Ch.6 Photolithography
<br>Ch.7 Plasma Basics
<br>Ch.8 Ion Implantation
<br>Ch.9 Etch
<br>Ch.10 CVD and Dielectric Thin Film
<br>Ch.11 Metallization
<br>Ch.12 Process Integration
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<br>二、指定用書(Text Books)
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<br>"Introduction to Semiconductor Manufacturing Technology”
<br>Hong Xiao, Prentice Hall Inc., New Jersey, USA, 2001.
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<br>三、參考書籍(References)
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<br>"Semiconductor Manufacturing Technology"
<br>M. Quirk and J. Serda, Prentice Hall, New Jersey, USA, 2001.
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<br>"Semiconductor Devices Physics and Technology”, 2nd Edition, 
<br>S. M. Sze, John Wiley & Sons, Inc., New York, USA, 2002.
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<br>"Silicon VLSI Technology: Fundamentals, Practice and Modeling”, 
<br>James D. Plummer, M. D. Deal, and P. B. Griffin, Prentice Hall, 
<br>New Jersey, USA, 2000.
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<br>"VLSI製造技術”, 莊達人, 高立圖書, 2002.
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<br>四、教學方式(Teaching Method)
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<br>以power point說明, 按text book課程內容循序講授
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<br>五、教學進度(Syllabus)
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<br>Ch.1 Introduction (1 hr)
<br>Ch.2 Introduction of IC Fabrication (1 hr)
<br>Ch.3 Semiconductor Basics (3 hr)
<br>Ch.4 Wafer Manufacturing and Epitaxy (3 hr)
<br>Ch.5 Thermal Processes (6 hr)
<br>Ch.6 Photolithography (6 hr)
<br>Ch.7 Plasma Basics (3 hr)
<br>Ch.8 Ion Implantation (3 hr)
<br>Ch.9 Etch (6 hr)
<br>Ch.10 CVD and Dielectric Thin Film (6 hr)
<br>Ch.11 Metallization (6 hr)
<br>Ch.12 Process Integration (3 hr)
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<br> 六、成績考核(Evaluation)
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<br>Examination (Twice), Homework, Report, Interaction at class 
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<br> 七、可連結之網頁位址
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<br>Please contact with the teaching assistants.
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