一、課程說明(Course Description)
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<br>Understanding the fundamental micro fabrication technology for
<br>MicroElectroMechanical Systems (MEMS).
<br>There will be five basic MEMS fabrication techniques taught,
<br>including wafer cleaning and thermal oxidation,
<br>microlithography and wet/dry etching, e-beam evaporation,
<br>bulk and surface micromachining, and micro electro-plating.
<br>Students will need to attend one of the lab sessions and finish all five 
<br>experiments besides lectures.
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<br>二、指定用書(Text Books)
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<br>Lecture notes and lab handouts
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<br>三、參考書籍(References)
<br>
<br>Fundamentals of Microfabrication, Madou, 1997.
<br>Introduction to Microelectronic Fabrication, Jaeger, 1998.
<br>The Science and Engineering of Microelectronic Fabrication, Campbell, 2001
<br>Silicon VLSI Technology: Fundamentals, Practice, and Modeling, Plummer, 2000
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<br>四、教學方式(Teaching Method)
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<br>Lecture: 2-3 hours/week
<br>Lab:     2-3 hours/lab, totally 5 labs
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<br>五、教學進度(Syllabus)
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<br>01.課程總覽，分組，安全規則講解，安全測驗
<br>02.Clean room, Wafer cleaning, and Thermal oxidation
<br>03.Microlithography and Lift-off process
<br>04.Wet etching technique
<br>05.Diffusion and Ion implantation
<br>06.Vacuum and Physical vapor deposition
<br>07.Bulk micromachining
<br>08.Midterm
<br>09.Thick-film lithography and Polymer microfabrication
<br>10.Chemical vapor deposition and Reactive ion etching
<br>11.Surface micromachining and Process integration
<br>12.MEMS packaging
<br>13.Characterization techniques
<br>14.BioMEMS
<br>15.Optical MEMS and RF MEMS
<br>16.Final Exam
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<br>六、成績考核(Evaluation)
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<br>Grade: Lab 40%, Midterm 25%, Final 30%, HW 5~10%
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<br>七、可連結之網頁位址