一、課程說明(Course Description)
此課程為半導體製程技術與原理的探討與介紹，可學習到半導體製程技術的演進、各製程步驟與製程設備的主要技術原理及重要的基礎觀念，為從事積體電路製造、積體電路元件與積體電路設計的核心基礎課程，有助學員日後投入半導體、光電等相關產業，課程內容包含:
* Introduction of IC Fabrication
* Semiconductor Basics
* Wafer Manufacturing and Epitaxy
* Thermal Processes
* Photolithography
* Plasma Basics
* Ion Implantation
* Etch
* CVD and Dielectric Thin Film
* Metallization
* Process Integration
二、指定用書(Text Books)
"Introduction to Semiconductor Manufacturing Technology”
Hong Xiao, Prentice Hall Inc., New Jersey, USA, 2001.
三、參考書籍(References)
1. M. Quirk and J. Serda, "Semiconductor Manufacturing Technology", Prentice Hall, New Jersey, USA, 2001.
2. S. M. Sze, "Semiconductor Devices Physics and Technology”, 2nd Edition, John Wiley & Sons, Inc., New York, USA, 2002.
3. James D. Plummer, M. D. Deal, and P. B. Griffin, "Silicon VLSI Technology: Fundamentals, Practice and Modeling”, Prentice Hall, New Jersey, USA, 2000.
4. 莊達人, "VLSI製造技術”, 高立圖書, 2002.
四、教學方式(Teaching Method)
綜合數本優良教科書的精華，以power point編撰上課講義說明，上課前將教材電子檔置於 iLMS 數位學習系統 http://lms.nthu.edu.tw/ 供學生下載預習。
五、教學進度(Syllabus)
1. Introduction of IC Fabrication (2 hr)
2. Semiconductor Basics (3 hr)
3. Wafer Manufacturing and Epitaxy (3 hr)
4. Thermal Processes (6 hr)
5. Photolithography (6 hr)
6. Mid-term Exam. (3 hr)
7. Plasma Basics (3 hr)
8. Ion Implantation (3 hr)
9. Etch (6 hr)
10. CVD and Dielectric Thin Film (6 hr)
11. Metallization (6 hr)
12. Process Integration (3 hr)
13. Final Exam. (3 hr)
六、成績考核(Evaluation)
Examination (Twice), Homework, Report, Interaction at class
七、可連結之網頁位址