一、課程說明(Course Description)
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<br> 二、指定用書(Text Books)
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<br>1.“Fundamentals of Microsystems Packaging”, Rao R. Tummala, McGraw-Hill, 2001
<br>2.Note files will be given at lecture. 
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<br> 三、參考書籍(References)
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<br>1.“Electronic packaging: design, materials, process, and reliability”, John Lau, C.P. Wong, John L. Prince, 
<br>and Wataru Nakayama, McGraw Hill, 1998.
<br>2.“Semiconductor Packaging: a multidisciplinary approach”, Robert J. Hannemann, Allan D. Kraus, and 
<br>Michael Pecht, Wiley Interscience, 1994.
<br>3.“微系統封裝原理與技術”, 邱碧秀著, 滄海書局, 2005.
<br>4.“Area Array Packaging Handbook”,  Ken Gilleo, Editor, McGraw-Hill, 2002.
<br>5.“Advanced Electronic Packaging with emphasis on multichip modules”, William D. Brown, IEEE-Press, 
<br>1999.
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<br> 四、教學方式(Teaching Method)
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<br>Lecture: 3 hours per week. (Every Tuesday 9-12 AM)
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<br> 五、教學進度(Syllabus)
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<br>課程內容:
<br>1.Introduction to MEMS 
<br>2.Traditional microelectronic packaging and MEMS packaging 
<br>3.Die Attach/Chip Bond, Chip level interconnections, and Solder bonding 
<br>4.MEMS release technique 
<br>5.Multi-chip Module(MCM) and Chip scale packaging 
<br>6.Electronic design, analysis of packaging 
<br>7.Thermal design, analysis of packaging 
<br>8.Array packaging and other MEMS packaging 
<br>9.Mechanical design, analysis of packaging 
<br>Midterm exam 
<br>10.MEMS reliability issue 
<br>11.Failure mechanisms and mechanical design for reliability 
<br>12.Failure analysis and case study 
<br>Term project presentation 
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<br> 六、成績考核(Evaluation)
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<br>Grades: Homework 20%, Midterm 30%, Term project (report and presentation)50%
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<br> 七、可連結之網頁位址
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