一、課程說明(Course Description)
<br>    本課程內容涵蓋面向頗廣，且無適當教科書可採用，因此除課堂講授外，另要求同學閱讀不少文獻，為落實同學的閱讀，將針對該內容做小考，並會適量針對閱讀文獻做互動式討論。
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<br>二、指定用書(Text Books)
<br>    無
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<br>三、參考書籍(References)
<br>1. Kraus, A.D. and Bar-Cohen, A., “Thermal Analysis and Control of Electronic Equipment,” 1983.
<br>2. Yeh, L.T. and Chu, R.C., “Thermal Management of Microelectronic Equipment,” 2002.
<br>3. Incropera, F.P., DeWitt, D.P., Bergman, T.L., and Lavine, A.S., “Fundamentals of Heat and Mass Transfer,” 6th Ed., 2007. ()
<br>4. Munson, B.R., Young, D.F. and Okiishi, T.H., “Fundamentals of Fluid Mechanics,” 5th Ed., 2006.
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<br>四、教學方式(Teaching Method)
<br>   課堂講授與互動式討論
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<br>五、教學進度(Syllabus)
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<br>Introduction to Thermal Management of Electronic Equipment
<br>Review of Heat Transfer
<br>Contact Resistance and Interface Materials
<br>Radiative Exchange Between Surfaces
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<br>AIR COOLING SYSTEMS
<br>Heat Sinks and Heat Spreaders
<br>    Optimal Channel Spacing of Fins under Natural and Forced Convection
<br>    Optimal Sizing of Planar Heat Spreaders
<br>Heat Pipe and Vapor Chamber
<br>    Evaporation, Boiling and Condensation, Surface Tension
<br>    Thin Film Evaporation
<br>Fans
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<br>Liquid Cooling Systems
<br>Thermoelectric Cooling
<br>LED Cooling
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<br>六、成績考核(Evaluation)
<br>Article Reading Reports and Homeworks 25%
<br>Experiments    15%
<br>Mid-term exam  25%
<br>Final exam  25%
<br>Semester Report (written and oral)  10%
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<br>七、可連結之網頁位址
<br>140.114.58.65(建構中)
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