一、課程說明(Course Description)
The silicon integrated circuit is surely one of the wonders of our age. The
ability to fabricate tens of millions of individual components on a chip with an
area of a few centimeter square has enabled the information age. This course
attempts to describe not only the manufacturing practice associated with the
technologies used in silicon chip fabrication, but also the underlying scientific
basis for those technologies.


二、指定用書(Text Books)
1. J. D. Plummer, M. M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice
Hall, 2000.
2. Michael Quirk and Julian Serda, Semiconductor Manufacturing Technology, Prentice
Hall, 2001.
3. Robert Doering and Yoshio Nishi, Handbook of Semiconductor Manufacturing Technology,
CRC Press 2008.


三、參考書籍(References)
To be announced


四、教學方式(Teaching Method)
1. In Chinese
2. power point slides will be uploaded in the e-learning system one week before we
start the chapter.
3. We may invite few speakers from industry to give a more comprehensive and
advanced view on some special issues discussed in our lecture.


五、教學進度(Syllabus)
1. Introduction
2. Modern Electronic Device Technology
3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers
4. Semiconductor Manufacturing
5. Lithography
6. Thermal Oxidation
7. Diffusion
8. Ion Implantation
9. Thin Film Deposition
10. Etching
11. Back-end technology


六、成績考核(Evaluation)
1 Midterms (25% for each)
2 Final (30%)
3 Homework (20%)