一、課程說明(Course Desc<x>ription)
<br>
<br> Electronic packaging is to connect integrated circuits and other electronic 
<br>components together in a system so that the designed functions of the system can 
<br>be performed. The electronic packaging industry belongs to the latter part of 
<br>the electronic industry, and is interdependent with the integrated circuit 
<br>manufacturing industry. This course introduces the manufacturing processes and 
<br>materials used in electronic packaging, so that students have an understanding 
<br>of the field of electronic packaging. In the future, students can use this 
<br>foundation, plus their own original expertise, as the starting point for entry 
<br>and contribution to the field of electronic industry.
<br>
<br>二、指定用書(Text Books)
<br>
<br>電子構裝材料與技術，陳信文、陳立軒、林永森、陳志銘，高立圖書，2004
<br>
<br>三、參考書籍(References)
<br>
<br>微系統構裝材料與技術，陳信文、陳立軒、林永森、陳志銘，高立圖書，2002
<br>
<br>四、教學方式(Teaching Method)
<br>
<br>課堂講授
<br>
<br>五、教學進度(Syllabus)
<br>
<br>1. Introduction of electronic packaging	
<br>2. Silicon wafer, Integrated circuites manufacturing 
<br>3. Types of first level packaging, Cutting, Die bonding
<br>5. Wire bonding		
<br>6. Leadfr<x>ames
<br>7. Transfer molding and molding compounds (I)
<br>8. Transfer molding and molding compounds (II)
<br>9. Midterm examination	
<br>10. Stamping, forming	
<br>10. Liquid encapsulant	
<br>11. Ceramic packaging
<br>12. Ceramic packaging
<br>13. Printed circuit board(I)
<br>14. Printed circuit board (II)
<br>15. Electronic soldeirng (I)
<br>15. Electronic soldering (II)	
<br>16. Electronic propertied and heat transfer  
<br>17. FCP 、BGA、CSP 
<br>18. Final examination
<br>
<br>六、成績考核(Evaluation)
<br>
<br>Homeworkd assisngments and quizes	20%
<br>Midterm examination	35%
<br>Final examination	45%
<br>Misc     5%
<br>
<br>七、可連結之網頁位址
<br>
<br>
<br>
<br>