一、課程說明(Course Desc<x>ription)
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<br>此課程為半導體製程技術與原理的探討與介紹，可學習到半導體製程技術的演進、各製程步驟與製
<br>程設備的主要技術原理及重要的基礎觀念，為從事積體電路製造、積體電路元件與積體電路設計的
<br>核心基礎課程，有助學員日後投入半導體、光電、微機電與感測器等相關產業，課程內容包含: 
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<br>* Introduction of IC Fabrication
<br>* Semiconductor Basics
<br>* Wafer Manufacturing and Epitaxy 
<br>* Thermal Processes
<br>* Photolithography	
<br>* Plasma Basics
<br>* Ion Implantation
<br>* Etch
<br>* CVD and Dielectric Thin Film
<br>* PVD and me<x>tallization
<br>* Process Integration
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<br>二、指定用書(Text Books)
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<br>Hong Xiao, "Introduction to Semiconductor Manufacturing Technology", 2nd 
<br>Edition, SPIE Press, Bellingham, Washington USA, 2012.
<br>半導體製程技術導論(修訂二版, 蕭宏 原著), 全華圖書, 2014.
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<br>三、參考書籍(References)
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<br>1. M. Quirk and J. Serda, "Semiconductor Manufacturing Technology", Prentice 
<br>Hall, New Jersey, USA, 2001.
<br>2. IEDM short course.
<br>3. S. M. Sze and M. K. Lee, "Semiconductor Devices Physics and Technology”, 3rd 
<br>Edition, John Wiley & Sons, Inc., New York, USA, 2012.
<br>4. James D. Plummer, M. D. Deal, and P. B. Griffin, "Silicon VLSI Technology: 
<br>Fundamentals, Practice and Modeling”, Prentice Hall, New Jersey, USA, 2000.
<br>5. 莊達人, "VLSI製造技術”, 高立圖書, 2002.
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<br>四、教學方式(Teaching Method)
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<br>綜合數本優良教科書的精華，以power point編撰上課講義說明，上課前將教材電子檔置於 
<br>eLearn 數位學習平台供學生下載預習。
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<br>五、教學進度(Syllabus)
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<br>1. Introduction of IC Fabrication (3 hr)
<br>2. Semiconductor Basics (3 hr)
<br>3. Wafer Manufacturing and Epitaxy (3 hr)
<br>4. Thermal Processes (6 hr)
<br>5. Photolithography (6 hr)
<br>6. Mid-term Exam. 
<br>7. Plasma Basics (3 hr)
<br>8. Ion Implantation (3 hr)
<br>9. Etch (6 hr)
<br>10. CVD and Dielectric Thin Film (6 hr)
<br>11. me<x>tallization (6hr)
<br>12. Process Integration (3 hr)
<br>13. Final Exam. 
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<br>六、成績考核(Evaluation)
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<br>Examination (Twice), Homework, Report, Interaction at class 
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<br>七、可連結之網頁位址
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