課程大綱 Detailed Course Syllabus
● 課程說明(Silicon Processing Technology for Microelectronics)
11009 微電子工程(ULSI Technology)課程
The advances in ultra-large-scale-integration (ULSI) technology based on
aggressive scaling of CMOS devices provide enormous opportunities for high-
performance communication, and computing systems. This course is designed to
provide the current status of advanced ULSI technology process and CMOS
integration projecting a road map for nanoelectronic devices for the current and
next generation. 先修課程: 無
● 指定用書(Text Books)
1.教師自編的微電子工程 (ULSI Technology 500 pages) (Handout of related ULSI
Nanoelectronic devices SCI journal and conference papers)
2. Hong Xiao(蕭宏) 原著「Introduction to Semiconductor Manufacturing Technology」
(第二版)
● 參考書籍(References)
1. 相關半導體製程與整合之教科書
2. IEEE, IEDM, VLSI, SCI journal papers
● 教學方式(Teaching Method)
投影片教學 90%, 版書 10%
● 教學進度(Syllabus)
Chapter1: Unit Process Module (半導體單元製程)
Chapter2: ULSI Process Integration (半導體製程整合)
Chapter3: Semiconductor Device Material Analysis (半導體元件材料分析)
Chapter4: ULSI Advanced Process (半導體先進製程)
Chapter5: FinFET Process Integration for N14 (鰭式電晶體製程)
Chapter6: N5/N3/N2/N1 technology research and development (N5到N1製程研究與發展)
● 可連結之網頁位址 相關網頁(Personal Website)
1. https://semiwiki.com/ 2. http://www.imec.org/ 3. https://semiengineering.com/
4. https://www.eetimes.com/