1. 課程說明(Course Desc<x>ription):
<br>    It is well known that thin films are widely used in the electronic industry. 
<br>Due to the trend 
<br>on miniaturization of electronic devices, nanosclae electronic devices are 
<br>needed and the 
<br>technology and reliability of thin films have recently attracted increasing 
<br>attentions. This 
<br>course will focuses on the science and process of thin films, and reliability 
<br>science for thin 
<br>film application in the electronic industry. The topics will cover:
<br>- Fundamental topic in thin-film process: deposition, surface energy and atomic 
<br>diffusion
<br>- Application of diffusion equations (Fick’s first law and Fick’s second law)
<br>- Theoretical and practical understanding of electronic thin-film reliability: 
<br>me<x>tallurgical 
<br>reaction, electromigration, thermomigration and stressmigration
<br>
<br>
<br>2.指定用書(Text Books):
<br>    *"Electronic Thin-Film Reliability", King-Ning Tu, Cambridge University 
<br>Press, 2010, 
<br>ISBN 978-0-521- 51613-6.
<br>     *“Solder Joint Technology, Materials, properties and reliability", King-
<br>Ning Tu, Springer, 
<br>2007, ISBN 10:0-387-38890-7.
<br>
<br>3. 參考書籍(References)
<br>   * “Flip chip technologies”John H. Lau, McGraw-Hill, 1996.
<br>   *“Electronic Packaging, Design, Materials, Process, and Reliability” John 
<br>Lau, C.P. 
<br>Wong, John L. Prince, and Wataru Nakayama, McGraw-Hill.
<br>   *“Principles of Electronic Packaging”Donald P. Seraphim, Ronald C. Lasky, 
<br>Che-yu Li, 
<br>McGraw-Hill, 1993.
<br>   * Fundamentals of Microsystems Packaging, R.R. Tummala, McGrawHill,2001
<br>   * 微電子材料與製程，陳力俊主編中國材料科學學會 2000
<br>   * “Microelectronics packaging handbook” R.R. Tummala and E.J. Rymaszewski, 
<br>Van 
<br>Nostrand Reinhold, 1989.
<br>
<br>4. 教學方式(Teaching Method):
<br>   * 3 hours of lecture per week 
<br>   * Oral presentation 
<br>   * One Midterm, One Final 
<br>
<br>5.教學進度(Syllabus)
<br>    * Introduction: Thin Film Applications to Microelectronic Technology
<br>    * Thin film deposition and Surface energy
<br>    * Surface energy & Diffusion in solid
<br>    * Elastic stress & strain in thin film
<br>    * Introduction of reliability, FCT Reliability: me<x>tallurgical Reaction
<br>    * Interconnect Reliability: Electromigration in interconnect
<br>    * FCT reliability: Electromigration, thermomigration, stressmigration in FC 
<br>solder
<br>    * Packaging technology
<br>
<br>6. 成績考核(Evaluation)
<br>    * Homework+class activity 25 %
<br>    * Midterm I: 30%
<br>    * Final:  25%
<br>    * Presentation 20%
<br>
<br>7. 可連結之網頁位址 相關網頁(Personal Website)
<br>   eeclass數位學習系統:   https://eeclass.nthu.edu.tw/