一、課程說明(Course Desc<x>ription)
<br>
<br>Using micro fabrication technology to fabricate micro sensors, micro 
<br>structures, and micro actuators.  This course teaches 12 fundamental and 
<br>advance MEMS fabrication techniques, including cleaning procedure, lithography,
<br> thermal oxidation, lift off process, e-beam evaporation, reactive ion etching, 
<br>wet chemical etching, micro electroplating, thick PR lithography, anodic 
<br>bonding, wafer dicing, wire bonding, and standard process parameter testing 
<br>techniques.  The final goal will use those techniques to fabricate 12 different
<br> micro structures, sensors, and actuators, including accelerometer, humidity 
<br>sensor, temperature sensor, micro mirror, micro cantilever, thermal actuator, 
<br>flow sensor, micro channel, micro mixer, micro filter, and bulk etching testing
<br> structures, etc.  Students will be broken into 4 groups, and each group (~5 
<br>students) must finish the fabrication process of 3 wafers. This course is offered in English.
<br>
<br>
<br>
<br> 二、指定用書(Text Books)
<br>
<br>1.Advance Micro System Fabrication and Experiment, Lecture notes and Lab handouts by Fan-
<br>Gang 
<br>Tseng, Fall, 2016.
<br>
<br>
<br> 三、參考書籍(References)
<br>
<br>1.Fundamentals of Microfabrication, Marc Madou, CRC Press, 1997. 
<br>2.Introduction to Microelectronic Fabrication, Richard C. Jaeger, Addison-Wesley Publishing 
<br>Company, 
<br>Inc, 1998.
<br>3.Micromachined Transducers’ source book, Gregory T.A. Kovacs, McGraw-Hill, 1998.
<br>4.AIP Handbook of Modern Sensros, Jacob Fraden, American Institute of Phusics, 1993.
<br>
<br>
<br> 四、教學方式(Teaching Method)
<br>
<br>Lecture time: T7T8T9, Place: ESS 504
<br>Lab time: TBD (each week will need 3-8 hours for experiment), place: NESS 702/704/707/709)
<br>
<br>
<br> 五、Syllabus
<br>
<br>Tentative Outline for Advance Micro System Fabrication and Experiment:
<br>1.	Introduction, Lab safety, team assignment.  
<br>2.	Lec1: Wafer cleaning, thermal oxidation                                                                            
<br>Lab 1: Wafer cleaning (Standard, Pirhana), (Dry/Wet) thermal oxidation
<br>3.	Lec2: Lithography I                                                                                              
<br>*Lab 2: Lithography (AZ 5214, positive) for wet etching (mask #1, window for bulk micromachining)
<br>4.	Lec3: Wet chemical etching (Lab report #1)                                                                    
<br>Lab 3: Silicon dioxide wet etching (BOE) and PR strip (Pirhana)
<br>5.	Lec4:Lithography II                                                                      	  	                      
<br>Lab 4:Back side wet etching, PR patterning for lift-off process (AZ 5214, negative, mask #2, outline 
<br>and course name) (Lab report #2)
<br>6.	Lec5: Vacuum System                                                                                     
<br>*Lab 5: Vacuum, E-beam deposition of Ti/Ni (300/1500 A)
<br>7.	Lec6: Physical Vapor Deposition          								             
<br>Lab 6: Lift-off process, and PR striping (organic stripper)
<br>8.	Lec7: Dry etching technique. (Lab report #3)			                                              
<br>Lab 7: Lithography patterning Ti/Ni  by wet etching (AZ 5214, positive, mask #2, device)
<br>9.	Midterm                                                                                                                          
<br>10.	Lec8: Polymer MEMS                                                                                                     
<br>*Lab 8: Thick PR process for plating (SJR 5740, mask #3, mask for plating)
<br>11.	Lec9: Through mask Plating  (Lab report #4)                                                                   
<br>Lab 9: Nickel plating, PR strip. 
<br>12.	Lec10: Bulk Micromachining                                                                                             
<br>*Lab 10: HF dip, TMAH bulk etching     
<br>13.	Lec11: MEMS packaging  (Lab report #5)                                                                         
<br>Lab 11: Anodic wafer bonding
<br>14.	Lec12: Micro device testing                                                                                              
<br>Lab 12: Micro sensors (Humidity sensor, temp sensor/heater, accelerometer…),micro actuators and 
<br>micro structures testing 
<br>15.	Lec: SEM technique                                                                                                            
<br>*Lab 13: SEM micro structures
<br>16.	Final Exam                                                                                                                         
<br>17.	Final lab report due by one week after the final exam.                                                                                                                 
<br>
<br>
<br> 六、Evaluation
<br>
<br>Grade: Lab: 50%(lab report 35%, other 15%), Midterm: 20%, Final: 30%
<br>
<br>
<br> 七、webpage:
<br>
<br>fangang.web.nthu.edu.tw
<br>
<br>