Course Desc<x>ription:
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<br>This course will include 6 major topics dividing into 2 semesters and provide 
<br>student essential capabilities to understand the challenges and requirement in 
<br>each design phases for advanced design methodologies. They are:
<br>1. Overall System Level Design Planning and EDA (Electronic Design Automation)
<br>2. Digital Design and Sign-off
<br>3. Custom, Analog and RF Design
<br>4. RF and Simulation with DRC/LVS
<br>5. SiP, System-in-package (Modifying Components and Netlist/Setting Design Rules), 
<br>Design Verification and Manufacturing Output
<br>6. Routing and High-Density Interconnect with Simulation
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<br>In the first semester, this course will focus on the overview of system level 
<br>design architecture and how EDA tools can help design planning and production. 
<br>Then the course will introduce from digital IC design, analog and mixed signal IC 
<br>design with close loop simulation and verification methodology.
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<br>References: Cadence Design System
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<br>Teaching Method: Lectures and discussions
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<br>Syllabus: 
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<br>1. Overall System Level Design Planning: Integrated 3D-IC Platform 		
<br>2. Digital Design and Sign-off: Synthesis and Test
<br>3. Digital Design and Sign-off: Implementation
<br>4. Digital Design and Sign-off: Silicon Signoff, Equivalence Checking
<br>5. Custom IC, Analog and RF Design: Circuit Design, Simulation, Modeling and RF 
<br>Design
<br>6. Custom IC, Analog and RF Design: Layout Design and Advanced Nodes
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<br>Evaluation: One midterm exam and one final exam 
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<br>Website: eeclass