一、課程說明(Course Description)







二、指定用書(Text Books)



1.“Fundamentals of Microsystems Packaging”, Rao R. Tummala, McGraw-Hill, 2001

2. Note files will be given at lecture.





三、參考書籍(References)



1.“Electronic packaging: design, materials, process, and reliability”, John Lau, C.P. Wong, John L.

Prince,

and Wataru Nakayama, McGraw Hill, 1998.

2.“Semiconductor Packaging: a multidisciplinary approach”, Robert J. Hannemann, Allan D. Kraus,

and

Michael Pecht, Wiley Interscience, 1994.

3.“微系統封裝原理與技術”, 邱碧秀著, 滄海書局, 2005.

4.“Area Array Packaging Handbook”, Ken Gilleo, Editor, McGraw-Hill, 2002.

5.“Advanced Electronic Packaging with emphasis on multichip modules”, William D. Brown, IEEE-

Press,

1999.





四、教學方式(Teaching Method)



Lecture: 3 hours per week. (Every Tuesday 9-12 AM)



五、教學進度(Syllabus)



課程內容:

1.Introduction to MEMS

2.Traditional microelectronic packaging and MEMS packaging

3.Die Attach/Chip Bond, Chip level interconnections, and Solder bonding

4.MEMS release technique

5.Multi-chip Module(MCM), Chip scale packaging, and Array packaging

6. ANSYS simulation tool

7.Electronic design, analysis of packaging

8.Thermal design, analysis of packaging

9.Array packaging and other MEMS packaging

10.Mechanical design, analysis of packaging



Midterm exam



11.MEMS reliability issue

12.Failure mechanisms and mechanical design for reliability

13.Failure analysis and case study



Term project presentation





六、成績考核(Evaluation)



Grades: Homework 20%, Midterm 30%, Term project (report and presentation)50%





七、可連結之網頁位址