課程說明:
邀請DRAM大廠的專家共同講述DRAM設計、智慧製造、先進封測與產品應用

指定用書: slides

教學方式:上課講授並實地至DRAM大廠參觀

成績考核: 考試與課堂表現

Class & Course Topic

Class 1
Professor Lai's Opening (course/ study materials/ exam introduction ect.)

Class 2
Micron Business Leader's Opening
DRAM Probing and Failure Analysis

Class 3
DRAM Design, Device (DEG) introduction
What's DRAM / DRAM Application (30mins)
DRAM Architecture / Product Testing (80mins)

Class 4
Photo Process

Class 5
Dry Etch Process
Thin Film Process

Class 6
CMP Process
WET Process

Class 7
Diffusion Process
Data Science application in Photolithography

Class 8
DRAM Advanced Defect Detection
Methodology Application

Class 9
CSM (Control System Management) Overview
Machine Learning on Advanced Process Control

Class 10
Sports Day (Suspend a Class)

Class 11
MQC (Material Qality Control)
FAB AMC process & ESD/Cleanliness quality control
Incoming Material Quality control and detection introduction

Class 12
Exam (Suspend a Class)

Class 13
SMAI (Smart Manufacturing & Artificial Intelligence)
Data Engineering Challenges in Semiconductor Data
Machine Learning Challenges in Production
Deep Learning for Memory Array Failure Classification

Class 14
Green New Fab Design & Construction
Sustainability Concept & Achievement

Class 15
Smart Facility operation
PDE Assembly Package Introduction

Class 16
APTD (Advanced Packaging Technology Development)
Advanced Package Introduction - Now and Future

Class 17
Field Application Engineering
DRAM Basic Operations and (System) Design Considerations
Market Requirements vs. Different Type of DRAM and Trend
Features of DDR4/DDR5/LPDDR4/LPDDR5/GDDR6x
Near Memory, Main Memory and Far Memory
High Speed Memory Design Guide and Considerations

Class 18
Workshop and Open Discussion