A、課程說明(Course Description)
本課程將以英文授課,主要介紹半導體製程,包括基本原理,製程技術全貌,及實際工業上應用.使研
究所學生在跨入業界或更深入研究前,對半導體製程技術,能一窺全貌,將來能學以致用。
(PS: 本11210CSR 540100 半導體製程導讀(Introduction to Semiconductor Process)內容類
似原93年之[MS540400半導體製程課程]、 [MS437000半導體製程課程]、與 [MS4141000半導體製
程課程],[MS540400半導體製程課程],因此將申請抵免抵免NDL之「積體電路製程
技術訓練班]。)

This course will be offered in English and will introduce semiconductor
processing, including materials/devices basics, process technologies, and their
application in industry. The students can have a thorough overview on
semiconductor process technologies before going industry or for further indepth
studies.

PS: For the students who pass this course 11210CSR 540100 (Introduction to
Semiconductor Process), we will apply its waive to take the NDL's training
course of Integrated Circuit Processing Technology, which is required by NDL
before the usage of NDL facilities.

B、指定用書(Text Books)

1. Introduction to Semiconductor Manufacturing Technology, by Hong
Xiao, Prentice-Hall,(2001) ISBN 0-13-022404-9

C、參考書籍(References)

1. Modern Semiconductor Devices for Integrated Circuits, by Chenming Hu, 2009
ISBN-10: 0136085253
2. Semiconductor Manufacturing Technology, by Michael Quirk and Julian Serda
(2001), Prentice Hall Inc.(2001), ISBN 0-13-122937-01.
3. Semiconductor Devices Physics and Technology, S M Sze, John Wiley and Sons,
(1985)
4. Silicon VLSI Technology, James D. Plummer, Michael D. Deal, Peter B.
Griffin, Prentice-Hall Electronics and VLSI Series, Charles Sodini, Series
Editors, (2000), ISBN 0-13-178458-7
5. The Science and Engineering of Microelectronic Fabrication, Stephen A.
Campbell, Oxford University Press,(2001), ISBN 0-19-513605-5
6. Semiconductor Devices, Physics, and Technology, S M Sze, John Wiley & Sons
(1985)
7. Semiconductor International, Journal
8. Solid State Technology, Journal

D、教學方式(Teaching Method)

1. Lecture with projectors
2. Group discussion in the class

E、教學進度(Syllabus)

1. 2 weeks: Semiconductor industry introduction
2. 2 weeks: CMOS semiconductor materials/device basics
3. 4 weeks: IC process flow - FEOL (Integration and modules)
4. 1 week: Midterm exam
5. 4 weeks: IC process flow - BEOL (Integration and modules)
6. 2 weeks: Packaging and Future technology challenges and trends
7. 1 week: Final exam

F、成績考核(Evaluation)

1. Mid-term exam (30%)
2. Homework (30%)
3. Final exam (30%)
4. Interaction at class (5%) if attending >80%, 5% for group-study and Q&A bonus

G. 教師及助教 (Teaching Assistants)

1. 教師: 游萃蓉 (Tri-Rung Yew), X42573, 0936347230, 台達館 (Delta building):
R412, tryew@mx.nthu.edu.tw,
2. 助教 TA: 材料科技館 (Material Technology Building) R311: 
  李奕涵 yihan425@gmail.com, 03-5715131 ext 33890
鄭雅馨 , 03-5715131 ext 33890
馬嘉謙 , 03-5715131 ext 33890
曾彥揚 , 03-5715131 ext 33640


H、可連結之網頁位址 (NTHU eelcass)

Upload handouts and communicate with students.