一、課程說明(Course Desc<x>ription)
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<br>Using micro fabrication technology to fabricate micro sensors, micro 
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<br>structures, and micro actuators.  This course teaches 12 fundamental and 
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<br>advance MEMS fabrication techniques, including cleaning procedure, lithography,
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<br> thermal oxidation, lift off process, e-beam evaporation, reactive ion etching, 
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<br>wet chemical etching, micro electroplating, thick PR lithography, anodic 
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<br>bonding, wafer dicing, wire bonding, and standard process parameter testing 
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<br>techniques.  The final goal will use those techniques to fabricate 12 different
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<br> micro structures, sensors, and actuators, including accelerometer, humidity 
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<br>sensor, temperature sensor, micro mirror, micro cantilever, thermal actuator, 
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<br>flow sensor, micro channel, micro mixer, micro filter, and bulk etching testing
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<br> structures, etc.  Students will be broken into 4 groups, and each group (~5 
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<br>students) must finish the fabrication process of 3 wafers. This course is offered in English.
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<br> 二、指定用書(Text Books)
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<br>1.Advance Micro System Fabrication and Experiment, Lecture notes and Lab handouts by Fan-
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<br>Gang 
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<br>Tseng, Fall, 2016.
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<br> 三、參考書籍(References)
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<br>1.Fundamentals of Microfabrication, Marc Madou, CRC Press, 1997. 
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<br>2.Introduction to Microelectronic Fabrication, Richard C. Jaeger, Addison-Wesley Publishing 
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<br>Company, 
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<br>Inc, 1998.
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<br>3.Micromachined Transducers’ source book, Gregory T.A. Kovacs, McGraw-Hill, 1998.
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<br>4.AIP Handbook of Modern Sensros, Jacob Fraden, American Institute of Phusics, 1993.
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<br> 四、教學方式(Teaching Method)
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<br>Lecture time: F789, Place: ESS 504
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<br>Lab time: TBD (each week will need 3-8 hours for experiment), place: NESS 702/704/707/709)
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<br> 五、Syllabus
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<br>Tentative Outline for Advance Micro System Fabrication and Experiment:
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<br>1.	Introduction, Lab safety, team assignment.  
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<br>2.	Lec1: Wafer cleaning, thermal oxidation                                                                            
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<br>Lab 1: Wafer cleaning (Standard, Pirhana), (Dry/Wet) thermal oxidation
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<br>3.	Lec2: Lithography I                                                                                              
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<br>*Lab 2: Lithography (AZ 5214, positive) for wet etching (mask #1, window for bulk micromachining)
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<br>4.	Lec3: Wet chemical etching (Lab report #1)                                                                    
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<br>Lab 3: Silicon dioxide wet etching (BOE) and PR strip (Pirhana)
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<br>5.	Lec4:Lithography II                                                                      	  	                      
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<br>Lab 4:Back side wet etching, PR patterning for lift-off process (AZ 5214, negative, mask #2, outline 
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<br>and course name) (Lab report #2)
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<br>6.	Lec5: Vacuum System                                                                                     
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<br>*Lab 5: Vacuum, E-beam deposition of Ti/Ni (300/1500 A)
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<br>7.	Lec6: Physical Vapor Deposition          								             
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<br>Lab 6: Lift-off process, and PR striping (organic stripper)
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<br>8.	Lec7: Dry etching technique. (Lab report #3)			                                              
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<br>Lab 7: Lithography patterning Ti/Ni  by wet etching (AZ 5214, positive, mask #2, device)
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<br>9.	Midterm                                                                                                                          
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<br>10.	Lec8: Polymer MEMS                                                                                                     
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<br>*Lab 8: Thick PR process for plating (SJR 5740, mask #3, mask for plating)
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<br>11.	Lec9: Through mask Plating  (Lab report #4)                                                                   
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<br>Lab 9: Nickel plating, PR strip. 
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<br>12.	Lec10: Bulk Micromachining                                                                                             
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<br>*Lab 10: HF dip, TMAH bulk etching     
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<br>13.	Lec11: MEMS packaging  (Lab report #5)                                                                         
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<br>Lab 11: Anodic wafer bonding
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<br>14.	Lec12: Micro device testing                                                                                              
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<br>Lab 12: Micro sensors (Humidity sensor, temp sensor/heater, accelerometer…),micro actuators and 
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<br>micro structures testing 
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<br>15.	Lec: SEM technique                                                                                                            
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<br>*Lab 13: SEM micro structures
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<br>16.	Final Exam                                                                                                                         
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<br>17.	Final lab report due by one week after the final exam.                                                                                                                 
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<br> 六、Evaluation
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<br>Grade: Lab: 50%(lab report 35%, other 15%), Midterm: 20%, Final: 30%
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<br> 七、webpage:
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<br>fangang.web.nthu.edu.tw
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