一、課程說明(Course Description)

以半導體元件封裝為基礎，進行微機電元件的封裝製程設計教授。從封裝模組的選擇，電性，散熱及機械強度的考量
下，設計出最佳的元件封裝

製作方式。後半部將以元件及模組的可靠度分析與實證教授為主，進行可靠性及品管分析。

The course will focus on the packaging technique from microelectronics to MEMS device. The fundamental
packaging procedure will be taught at early semester. Then electric, thermal and mechanical designs will be
involved while selecting the proper packaging way to fulfill the purpose. The last several week will teach how
to design the reliability for your devices or products.

二、指定用書(Text Books)

1. (not required) “Fundamentals of Microsystems Packaging”, Rao R. Tummala, McGraw-Hill, 2001

2. Note files will be given at lecture.

三、參考書籍(References)

1.“Electronic packaging: design, materials, process, and reliability”, John Lau, C.P. Wong, John L.

Prince,

and Wataru Nakayama, McGraw Hill, 1998.

2.“Semiconductor Packaging: a multidisciplinary approach”, Robert J. Hannemann, Allan D. Kraus,

and

Michael Pecht, Wiley Interscience, 1994.

3.“微系統封裝原理與技術”, 邱碧秀著, 滄海書局, 2005.

4.“Area Array Packaging Handbook”, Ken Gilleo, Editor, McGraw-Hill, 2002.

5.“Advanced Electronic Packaging with emphasis on multichip modules”, William D. Brown, IEEE-

Press, 1999.

四、教學方式(Teaching Method)

Lecture: 3 hours per week. (Every Tuesday 9-12 AM)

五、教學進度(Syllabus)

課程內容:

1.Introduction to MEMS

2.Traditional microelectronic packaging and MEMS packaging

3.Die Attach/Chip Bond, Chip level interconnections, and Solder bonding

4.Multi-chip Module(MCM), Chip scale packaging, and Array packaging

5.Past 50 yrs packaging and future hybrid integration

6. ANSYS simulation tool

7.Electronic design, analysis of packaging

8.Thermal design, analysis of packaging

9.Mechanical design, analysis of packaging

10. PCB technology

Midterm exam

11.MEMS reliability issue

12.Failure mechanisms and mechanical design for reliability

13.Failure analysis and case study

Term project presentation

六、成績考核(Evaluation)

Grades: Homework 20%, Midterm 30%, Term project (report and presentation)50%

七、可連結之網頁位址